姓名：李婧

职称：讲师

方向：集成电路封装

系别：微电子系

团队：射频微波电路与微系统封装

邮箱：lijing1@cuit.edu.cn

【个人简介】

李婧，女，讲师，博士研究生学历，博士学位。近年来，在国内外高水平期刊和重要学术会议上发表论文10余篇,其中SCI收录5篇。博士期间作为主要参与人参加多项国家自然科学基金项目等国家级纵向科研项目。担任国际SCI期刊《Advanced Materials Interfaces》、《Sensors and Actuators A-Physical》等审稿专家。

【科研成果】

一、发表论文

1.Jing Li, Guoyun Zhou, Yan Hong, et al. Copolymer of pyrrole and 1,2-butanediol diglycidyl as an efficient additive leveler for through-hole copper electroplating[J]. ACS Omega,2020, 5: 4868-4874.

2.Jing Li, Guoyun Zhou, Yan Hong, et al.A catalytic interfacing PEDOT: PSS/CuPc polymerized on cloth fiber to electro-metalize stretchable copper conductive pattern[J]. Advanced Materials Interfaces, 2021, 2101462.

3.Jing Li, Guoyun Zhou, Yan Hong, et al.Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF[J]. Sensors and Actuators A-Physical, 2022, 37: 113415.

4. Jing Xiang, Shouxu Wang,Jing Li, et al. Electrochemical factors of leverlers on plating uniformity of through-holes: simulation and experiments[J]. Journal of The Electrochemical Society, 2018, 165(9): E359-E365.

5. Zhihua Tao, Wei He,Jing Li, et al. Texraoxa-diphosphaspiro derivative as suppressor for microvia filling by copper electroplating in acidic solution[J]. Journal of The Electrochemical Society, 2017, 164(14): D1032-D1041.

6. Li Zheng, Chong Wang,Jing Li, et al. Investigation of benzoquinone as a new type of Cu electroplating additive[C]. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017: 231-233.

二、授权专利

1.李婧，何为，周国云，等.一种用于直接电镀的表面处理工艺及其相关直接电镀工艺: CN201910429468.5 [P]. 2021-09-24.

2.陶志华，何为，李婧，等.一种用于铜互连HDI电镀填孔的抑制剂及电镀铜浴: CN201710535976.2 [P]. 2018-08-21.

【获奖情况】

1.2019年，教育部 科技进步二等奖，电子电路互连特种电子化学品关键技术及应用